Photonic Advanced Packaging - Production Process Engineer

Job Summary

Jabil is seeking a skilled and highly motivated Photonic Advanced Packaging Production Process Engineer to develop, optimize, and execute advanced packaging processes for integrated photonic devices. This role involves hands-on work in a state-of-the-art manufacturing environment, ensuring robust and scalable solutions for next-generation optical modules. The successful candidate will work primarily with Back End Silicon Photonic Wafer Processing, notably back grinding, ablation, dicing, marking and automatic optical inspection (AOI). There will also be opportunities to work with alignment and flip chip equipment.

Job Responsibilities

* Develop, optimize, and qualify advanced photonic packaging processes including, but not limited to, die attach, wire bonding, flip-chip assembly, optical alignment, hermetic sealing, and active optical coupling.
* Operate and maintain a variety of precision manufacturing equipment, including automated optical aligners, bonders, epoxy dispensers, and metrology tools.
* Design and execute experiments (DOE) to characterize process parameters, identify critical process windows, and drive continuous improvement initiatives for yield and reliability.
* Analyze process data using statistical methods to identify trends, troubleshoot issues, and implement corrective actions.
* Collaborate with design engineers, R&D teams, and manufacturing personnel to ensure seamless transfer of new products and processes from development to production.
* Develop and document detailed work instructions, process specifications, and manufacturing procedures.
* Perform routine equipment calibration, preventative maintenance, and minor troubleshooting to ensure optimal machine performance.
* Support failure analysis activities and implement root cause corrective actions for process-related issues.
* Adhere to all safety protocols and maintain a clean and organized work environment.

Job Qualifications

* **Education:**

Bachelor's degree in Electrical Engineering, Materials Science, Physics, Optics, Mechanical Engineering, or a related technical field for Engineer roles. Associate's degree or equivalent technical certification with significant relevant experience for Technician roles.

* **Experience:**

* **Engineer:** 3+ years of experience in advanced packaging, microelectronics assembly, or photonics manufacturing, with a focus on process development and optimization.

* **Technical Skills:**

* Strong understanding of optical assembly techniques, including active and passive alignment, fiber attach, and lensing.
* Familiarity with various bonding technologies (e.g., wire bonding, thermocompression bonding, epoxy bonding, eutectic bonding).
* Experience with precision dispensing systems, pick-and-place equipment, and automated manufacturing platforms.
* Proficiency in data analysis tools (e.g., JMP, Minitab, Excel) and statistical process control (SPC).
* Knowledge of materials science pertaining to packaging (adhesives, encapsulants, substrates).
* Ability to read and interpret engineering drawings, schematics, and manufacturing instructions.

* **Soft Skills:**

* Excellent problem-solving and analytical abilities.
* Strong written and verbal communication skills.
* Ability to work independently and as part of a cross-functional team.
* Detail-oriented with a commitment to quality and continuous improvement.
* Flexibility to adapt to changing priorities in a fast-paced environment.

Jabil, including its subsidiaries, is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, national origin, sex, age, disability, genetic information, veteran status, or any other characteristic protected by law.

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Accommodation Statement

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